For two decades, I have navigated the intersection of media and technology. Today, I am moving beyond the role of an observer to contribute a new piece of architecture to the global imaging community. I have officially released a defensive technical disclosure for a Dual-Sided BSI-CMOS Image Sensor with Integrated Microfluidic Thermal Management.

The Problem: Physics vs. Perception

Current 360-degree cameras rely on multiple sensors mounted back-to-back. This introduces a “parallax gap”—a physical distance between optical centers that makes seamless stitching nearly impossible for objects at close range. Additionally, stacking high-resolution sensors in small bodies creates extreme thermal density, leading to noise and hardware failure.

The Solution: A Unified Silicon Substrate

The architecture I am proposing utilizes a single-wafer design with active pixel arrays on both opposing faces. By using Back-Side Illumination (BSI) and Through-Silicon Vias (TSVs), we can create a sub-millimeter distance between sensor planes, effectively eliminating the stitch line.

To handle the heat, the design integrates etched micro-channels directly into the silicon. By circulating a dielectric coolant through these channels, we can remove heat directly from the center of the sensor “sandwich,” enabling higher frame rates and sustained performance.

Why Open Source?

I believe that the future of cinematography and mobile imaging should not be locked behind restrictive patents that stifle small-scale innovation. Therefore, I have released this disclosure under the CERN Open Hardware Licence Version 2 – Permissive (CERN-OHL-P). This allows any engineer, student, or filmmaker to use, modify, and build upon these concepts, provided the original authorship is acknowledged.

You can read the full technical disclosure and access the permanent record via the DOI link below.

View the Publication: https://doi.org/10.5281/zenodo.18343333